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Home › Events › TEI 2017: Eleventh International Conference on Tangible, Embedded, and Embodied Interaction

TEI 2017: Eleventh International Conference on Tangible, Embedded, and Embodied Interaction

March 20 - 23, 2017
Yokohama, Japan
ACM SIGCHI

The Association for Computer Machinery’s conference on Tangible, Embedded and Embodied Interaction addresses issues of human-computer interaction, design, interactive art, user experience, tools and technologies. A strong focus of the conference is how computing can bridge atoms and bits into cohesive interactive systems.

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